Reflow Oven Control

In this reflow oven control application, QKL electronic pressure regulator (I/P converter) is providing pressure to a reflow oven used to solder surface mount electronic components to PCBs. Generally, there are several zones in a reflow oven. Nitrogen is a common gas used in this process, as it reduces oxidation on the surfaces of the PCB. A QKL is controlling nitrogen going into an oven. The amount of oxygen in the oven is controlled by displacing O2 with N2 gas.

Our proportional pressure regulator is best suited for this application due to its high flow rate, fast response time, and high accuracy. Our regulators are capable of modulating from 2 bar to 65 bar with accuracy of 0.25% FS. (higher pressure range can be customised upon request)

QKL electronic pressure regulator can directly replace:
Proportion Air ( QB3H, QBS, GX, QBX, QPV, QB2 ), Festo ( VPPM, VPPL, VPPE, VEAA, VEAB, VEMD ), SMC (ITV1000, ITV2000, ITV3000), Clippard (Cordis), and ASCO (Sentronic)